AI Computing Power
The explosion of computing power driven by artificial intelligence and cloud computing has led to a surge in server power density, making heat dissipation a critical bottleneck. Jintian Copper provides high-thermal-conductivity copper alloy plates, precision copper tubes, and copper-based soaking plates (VC) for use in server CPU/GPU heat dissipation modules, cold plates, and connecting components in liquid cooling systems. Our materials exhibit extremely high thermal conductivity and excellent processing performance, serving as the core of efficient heat dissipation solutions. They help data centers break through the limits of computing power and ensure stable operation in the AI era.